Flip Chip Technology Market Research Report 2019-2025

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In the development of packaging of electronics, the main aim is to lower cost, increase the packaging density, and improve the performance by maintaining or improving the reliability of the circuits. The concept of the flip-chip process where the semiconductor chip is assembled face down onto the circuit board is ideal for size considerations because there is no extra area needed for contacting on the sides of the component. The performance in high-frequency applications is superior to other interconnection methods because the length of the connection path is minimized. Flip chip bumping is a vital step in the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a spacer to prevent electrical shorts and provides mechanical support.

The APAC held a large share of the overall flip chip technology market in 2017.

In 2019, the market size of Flip Chip Technology is xx million US$ and it will reach xx million US$ in 2025, growing at a CAGR of xx% from 2019; while in China, the market size is valued at xx million US$ and will increase to xx million US$ in 2025, with a CAGR of xx% during forecast period.

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In this report, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Flip Chip Technology.

This report studies the global market size of Flip Chip Technology, especially focuses on the key regions like United States, European Union, China, and other regions (Japan, Korea, India and Southeast Asia).

This study presents the Flip Chip Technology production, revenue, market share and growth rate for each key company, and also covers the breakdown data (production, consumption, revenue and market share) by regions, type and applications. history breakdown data from 2014 to 2019, and forecast to 2025.

For top companies in United States, European Union and China, this report investigates and analyzes the production, value, price, market share and growth rate for the top manufacturers, key data from 2014 to 2019.

In global market, the following companies are covered:

  • Samsung
  • Intel
  • Global Foundries
  • UMC
  • ASE
  • Amkor
  • STATS ChipPAC
  • Powertech
  • STMicroelectronics
  • Texas Instruments

Market Segment by Product Type

  • FC BGA
  • FC PGA
  • FC LGA
  • FC QFN
  • FC SiP
  • FC CSP

Market Segment by Application

  • Consumer electronics
  • Telecommunication
  • Automotive
  • Industrial sector
  • Medical devices
  • Smart technologies
  • Military & aerospace

Key Regions split in this report: breakdown data for each region.

  • United States
  • China
  • European Union
  • Rest of World (Japan, Korea, India and Southeast Asia)

The study objectives are:

  • To analyze and research the Flip Chip Technology status and future forecast in United States, European Union and China, involving sales, value (revenue), growth rate (CAGR), market share, historical and forecast.
  • To present the key Flip Chip Technology manufacturers, presenting the sales, revenue, market share, and recent development for key players.
  • To split the breakdown data by regions, type, companies and applications
  • To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
  • To identify significant trends, drivers, influence factors in global and regions
  • To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

In this study, the years considered to estimate the market size of Flip Chip Technology are as follows:

  • History Year: 2014–2018
  • Base Year: 2018
  • Estimated Year: 2019
  • Forecast Year 2019 to 2025

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Table of content

1 Report Overview
1.1 Research Scope
1.2 Major Manufacturers Covered in This Report
1.3 Market Segment by Type
1.3.1 Global Flip Chip Technology Market Size Growth Rate by Type (2019–2025)
1.3.2 FC BGA
1.3.3 FC PGA
1.3.4 FC LGA
1.3.5 FC QFN
1.3.6 FC SiP
1.3.7 FC CSP
1.4 Market Segment by Application
1.4.1 Global Flip Chip Technology Market Share by Application (2019–2025)
1.4.2 Consumer electronics
1.4.3 Telecommunication
1.4.4 Automotive
1.4.5 Industrial sector
1.4.6 Medical devices
1.4.7 Smart technologies
1.4.8 Military & aerospace
1.5 Study Objectives
1.6 Years Considered

2 Global Growth Trends
2.1 Production and Capacity Analysis
2.1.1 Global Flip Chip Technology Production Value 2014–2025
2.1.2 Global Flip Chip Technology Production 2014–2025
2.1.3 Global Flip Chip Technology Capacity 2014–2025
2.1.4 Global Flip Chip Technology Marketing Pricing and Trends
2.2 Key Producers Growth Rate (CAGR) 2019–2025
2.2.1 Global Flip Chip Technology Market Size CAGR of Key Regions
2.2.2 Global Flip Chip Technology Market Share of Key Regions
2.3 Industry Trends
2.3.1 Market Top Trends
2.3.2 Market Drivers

3 Market Share by Manufacturers
3.1 Capacity and Production by Manufacturers
3.1.1 Global Flip C

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